In-depth coverage of the latest Advanced Packaging developments, trends, and analysis — curated daily.
The industry has been wrestling with substrate shortages and the insatiable demand for AI. Now, Intel's first glass substrate prototypes, complete with co-packaged optics, offer a tantalizing glimpse into the future.
Glass substrates — Intel's bet against silicon limits — stand three years from market reality, per Amkor. Expect a seismic shift in how we pack AI's monstrous compute demands.
The era of monolithic AI silicon is over. Alchip's advanced 3DIC platform is ushering in a new age of heterogeneous integration, packing compute, memory, and I/O into unified packages.
AMD is doubling down on its Chinese manufacturing footprint with a significant expansion of its advanced packaging capabilities in Suzhou. This move signals a strategic bet on the region's indispensable role in the global semiconductor supply chain.
The industry has been wrestling with substrate shortages and the insatiable demand for AI. Now, Intel's first glass substrate prototypes, complete with co-packaged optics, offer a tantalizing glimpse into the future.
The era of monolithic AI silicon is over. Alchip's advanced 3DIC platform is ushering in a new age of heterogeneous integration, packing compute, memory, and I/O into unified packages.
Intel's aggressive push for its EMIB-T advanced packaging technology might be gaining traction, with NVIDIA's upcoming Rubin Ultra AI chips reportedly in the crosshairs, according to UBS.
The explosive growth of AI is running headlong into a fundamental problem: how do all those specialized chips talk to each other efficiently? Syenta, an Australian deep-tech startup, believes its proprietary manufacturing process holds the key.
The relentless AI supercycle is now directly impacting the cost of core computing components. Get ready for sticker shock as ABF substrate prices are set to jump significantly, with no end in sight.
Intel isn't waiting around. Massive equipment orders placed with Taiwanese manufacturers underscore the company's aggressive push to expand EMIB advanced packaging capacity, a direct shot at TSMC's dominance in the AI chip assembly race.
Vishay is rolling out a new thin film submount platform, touting its ability to handle the extreme demands of 800G, 1.6T, and 3.2T optical transceivers. We're diving into what's actually under the hood.
Forget sleek, expensive metal. Japan's military is now flying drones built from cardboard, costing less than a high-end gaming PC. This isn't just about cheap targets; it's a revolution in how we think about warfare.
Samsung Electro-Mechanics just posted its first-ever quarterly revenue over $2 billion, fueled by AI and auto sector demand. But a looming ABF substrate shortage could put a damper on this success.
Glass substrates — Intel's bet against silicon limits — stand three years from market reality, per Amkor. Expect a seismic shift in how we pack AI's monstrous compute demands.
Your LLM might be getting a speed boost, but don't expect it overnight. New research proposes a smarter way to stack computer chips, potentially slashing the time it takes for AI to generate text.