Chip Ferrites Get Peak Current Armor [Würth Elektronik]
When power supplies and motors switch on, they unleash brutal, short-lived current peaks that can obliterate standard chip bead ferrites. Now, one manufacturer has engineered a fix.
After five years of being left in the dust, PC gamers might finally get their hands on Devil May Cry 5's Special Edition goodies. SteamDB activity hints CAPCOM's finally ready to deliver.
When power supplies and motors switch on, they unleash brutal, short-lived current peaks that can obliterate standard chip bead ferrites. Now, one manufacturer has engineered a fix.
Samsung’s next flagship might have you asking: how much Ultra do you really need? The S27 Pro is shaping up to be a near-twin to its pricier sibling, with a camera tweak that’s more about your wallet than your photos.
Forget the geopolitical grandstanding. China's chip war is being quietly rewritten, not by governments, but by its own ambitious automakers. Xiaomi, BYD, and Nio are taking the reins, fundamentally altering the landscape of semiconductor sourcing.
Imagine a world where your screens never die, constantly sipping energy from the light around them. That future just got a whole lot closer.
Your AI morning briefing for May 26, 2026 — the top stories you need to know.
Samsung is reportedly pushing the envelope with a 900-layer V-NAND prototype, signaling a fierce competition in next-gen memory. This development could reshape the storage market.
The memory market's delicate balance is at risk. Samsung's bold move to prioritize next-gen HBM could leave the world scrambling for standard DRAM.
The insatiable hunger for AI computation is roasting the silicon. SK hynix's latest innovation, iHBM, aims to quench that thermal fire, embedding cooling elements directly into high-bandwidth memory packages.
Forget the press releases. The numbers are in, and they paint a stark picture: the world's top NAND suppliers just saw their sales explode. But this isn't a story of innovation; it's a masterclass in scarcity economics.
TSMC's pushing a battery overhaul, upgrading nearly half a million units. It's about more than just juice; it's about intelligence.
The future of computing is modular, but a new paper out of France reveals that this innovation comes with a hidden cost: an entirely new class of side-channel attacks.
Chip design's tedious library characterization phase just got an AI facelift. Siemens is betting its new Solido suite can slay the multi-week simulation dragon, but at what cost?