Xi Jinping's invocation of the Thucydides Trap signals a dangerous escalation in geopolitical rhetoric, with Taiwan's chip industry now squarely in its crosshairs. TSMC's COUPE initiative is more than just a manufacturing upgrade; it's a critical node in this unfolding global power struggle.
Another week, another whisper of Chinese tech theft, and a wafer fab supplier scrambling to deny it. This time it's GPTC, a critical cog in TSMC's advanced packaging machine, finding itself in the crosshairs.
TSMC's eyeing 2 million wafer starts by 2027 for advanced packaging. That's their fix for the AI industry's biggest choke point, with fabs in Taiwan and Arizona ramping hard.
Chiplets and advanced packaging are replacing monolithic chip design. Learn how this architectural shift is transforming semiconductor economics and performance.