The industry has been wrestling with substrate shortages and the insatiable demand for AI. Now, Intel's first glass substrate prototypes, complete with co-packaged optics, offer a tantalizing glimpse into the future.
NVIDIA isn't waiting. They're yanking co-packaged optics out of the future, slapping it onto their Feynman GPUs for a 2028 debut.
The relentless march of AI demands more from our data centers. Now, a new standard called XPO is trying to squeeze more bandwidth, and more heat, into the same rack space.
GPUs in AI data centers are choking on copper. Enter Tower and Scintil's laser chip—the world's first single-chip DWDM light engine. But is multiplexing the savior or just telecom nostalgia?