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TSMC advanced packaging facility in Taiwan with CoWoS technology stacks for AI chips
AI & GPU Accelerators

TSMC's $65B Bet: 2M Wafers to Fix AI Packaging Crunch by 2027

TSMC's eyeing 2 million wafer starts by 2027 for advanced packaging. That's their fix for the AI industry's biggest choke point, with fabs in Taiwan and Arizona ramping hard.

5 min read 1 month, 1 week ago
Graphic of US flag tightening noose around semiconductor equipment exports with Intel and Nvidia logos
Geopolitics & Supply Chain

[US MATCH Act] Tightens Chip Export Noose as Intel, Nvidia Pivot

Washington's latest export hammer drops — the MATCH Act — just as Intel refinances its way to Foundry dominance and Nvidia turns competitors into collaborators. These aren't isolated moves; they're the architecture of AI supremacy.

5 min read 1 month, 1 week ago

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