#3d-stacking

Advanced Packaging

LLM Decoding Gets a Nudge: New Chip Design [3D NMP]

Your LLM might be getting a speed boost, but don't expect it overnight. New research proposes a smarter way to stack computer chips, potentially slashing the time it takes for AI to generate text.

AI & GPU Accelerators

3D Stacking HBM on GPUs: Imec's Thermal Wake-Up Call

Silicon Valley's been drooling over 3D stacked GPUs for years, promising bandwidth bliss. Imec just ran the numbers: it'd fry 'em—unless you tweak everything.

Advanced Packaging

Chiplet Architecture and Advanced Packaging: The Future of Chip Design

Chiplets and advanced packaging are replacing monolithic chip design. Learn how this architectural shift is transforming semiconductor economics and performance.